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CLF5160
CLF5160 is formulated using purest chemical which guarantees absolute flux core continuity and consistency in solder properties.
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CLF4128
CLF4128 is a highly activated water soluble core flux for soldering on difficult to solder surface finishes. It is easily cleaned along with minimal odor and smoke.
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M097 (for standard stencil printing)
M097 solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability. It possesses excellent printing characteristics to a wide variety of metallization with an antislump proper...
MLED01 (for micro LED printing)
MLED01 lead free no clean solder paste is designed for superior performance on assemblies with ultra-fine pitch components and LED flip-chip package of mirco LED.
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LFF1 (water soluble application)
LFF1 solder paste designed for water soluble application. It offers repeatable and consistent paste transfer volume, excellent solderability with reduced voiding.
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LT95 (for low temp printing)
SnBiAg0.4 4-5LT95 low temperature solder alloy was developed to have better wettability in reflow soldering process. The flux residue is clear, colourless, and provide excellent electrical resistivity.
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Viromet 347 & 349
Viromet 347 & 349 is one of the high-performance lead free solder available in the industry. Viromet 347 & 349 solder bar can be used as a drop-in replacement for conventional SnPb solders in wave soldering an...
SnCu3.0 & 4.0
SnCu3.0 is one of the high-performing Pb-free solder available in the industry. It can be used in dipping soldering process. SnCu4.0 is effective solder alloy to minimize copper dissolution. Suitable to use on wire di...