About Us: Milestones

Company Milestones

  • YearEvent
  • 1977Incorporation of Singapore Asahi Chemical & Solder Industries Pte. Ltd.
  • 1983Asahi Metals (HK) Ltd. established
  • 1985ISO 9003 – certification on Good Manufacturing Practice
  • 1991Sinasahi Solder (M) Sdn. Bhd. established
  • 1992ISO 9002 – certification on Manufacturing and Management Systems
  • 1993Beijing Asahi Chemical & Solder Co. Ltd. established
  •     Shenzhen Longhua Asahi Solder Co. Ltd. established
  • 1995Wuxi Asahi Solder Co. Ltd. established
  •     Developed super reflective solder alloy with high fluidity and low dross characteristics
  • 1996Innovation Development Award from EDB for development of lead-free solder products
  •     Developed TSF high thermal fatigue lead free solder
  • 1997PT Sinasahi Solder Indonesia established
  •     Quantum Chemical Technologies (S) Pte. Ltd. established
  •     Matsushita Electronics Best Performance Award
  • 1998PT Sanyo Best Vendor Award
  • 1999Global Advance Metal Technology Pte. Ltd. established
  • 2000Matsushita Electronics Best Supplier award
  • 2001Lead Free Viromet launched
  • 2002Singapore Top 500 SME award
  •     Full implementation of our lead free solder products at Matsushita Electronics (S) Pte. Ltd.
  •     Approvals by Electronics manufacturing companies Casio, Sony, Thomson, Toshiba Tech and etc.
  •     Asahi Metals (SZ) Ltd. established
  •     Asahi Technologies America Inc. established
  • 2003Lead Free SCS7 launched2004   Asahi Solder Technology (Beijing) Co. Ltd. established
  •     Asahi Solder Technology (Wuxi) Co. Ltd. established
  •     Sony Green Partner certified lead free approval by Hitachi Communication Technologies Ltd. & Hitachi Medical Corp.
  •     ISO 9001:2000 certified
  •     ISO 14001:1996 certified
  • 2005ISO 14001:2004 certified
  • 2006SCS and Viromet listed under IPC Joint Industry Standard
  • 2007Asahi Technologies (Thailand) Ltd. established
  • 2013Murata Electronics (Thailand) Ltd. – Quality Partner award
  • 2014Pepperl+Fuchs – Best Performance Award
  • 2017Asahi (Tianjin) Solder Technology Co Ltd established
  • 2018ISO 9001:2015 & ISO 14001:2015 Certified

 

Technologies Milestones

  • YearEvent
  • 1994Filled the first patent of fluxless soldering.
  •            Started to engage GINTIC (former SIMTech) for its reliability and SMT services.
  • 1996Awarded IDS funding from EDB for our Lead Free Development project.
    1998    Filled Asahi first lead free patent and start on product developments for a Drop in
  •            Replacement Solder, Viromet.
  •            Gain recognition from high end industry such as medical and high reliability cum harsh
  •            environment equipment.
  • 2003Filled another Asahi Lead Free patent that is high reliability and cost effective especially
  • for wave soldering and manual soldering process, SCS7.
  • 2011Asahi embarked into development of Ag Paste for Renewable/Sustainable Energy.
  • 2013Asahi went into the development of Ag Ink for Large Area Processing in Printed
  •            Electronics.
  • 2014Development of Ag Nanowires as alternative to ITOs.
  • 2016Worked on Low Temperature paste, also work on semiconductor paste mainly on Die
  •             Attached Paste
  • 2017Patent granted for Ag Nanowires “Methods of Purifying Microstructures”
  • 2018Asahi went into project collaboration with Hebrew University/Create to developed Copper
  •             Ink for Printed Electronics.
  • 2019Worked on antimicrobial solution.
  •             Awarded Singapore patent for our AgNws.
  • 2020Awarded US Patent for AgNws and Copper Complex Ink; Taiwan Patent for AgNws.
  •            Applied new PCT patent for Thin copper Flakes for Conductive Ink.
  • 2021Awarded South Korea and Singapore Patent for AgNws.
  •    Antimicrobial Coating Solution is listed under Singapore Environment Agency (NEA) – Coating with Anti-virus Efficacy within 15mins contact time.
  • Developed Stretchable Silver Paste and Copper Paste for Printed Electronics
  • 2022Awarded China Patent for Copper Complex Ink and Japanese Patent for AgNws.
  •             Developed Thermally Conductive Elastomers.

            Solder Paste and Silver Paste for Micro LED and die attached application.