LT95 (for low temp printing)

SnBiAg0.4 4-5LT95 low temperature solder alloy was developed to have better wettability in reflow soldering process. The flux residue is clear, colourless, and provide excellent electrical resistivity.

Properties –

Halide Content

Flux Activity Classification

Viscosity

Powder Type

Not Detected

ROL0

400 – 1000 kcPs

Type 4

Packaging Options –

Syringe and Jar

Available Alloys –

SnBiAg0.4

Technical Documents –

 Product Data Sheet