LT95 (for low temp printing)
SnBiAg0.4 4-5LT95 low temperature solder alloy was developed to have better wettability in reflow soldering process. The flux residue is clear, colourless, and provide excellent electrical resistivity.
Properties –
Halide Content
Flux Activity Classification
Viscosity
Powder Type
Not Detected
ROL0
400 – 1000 kcPs
Type 4
Packaging Options –
Syringe and Jar
Available Alloys –
SnBiAg0.4
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