SnCu(3.0 & 4.0)
SnCu3.0 is one of the high-performing Pb-free solder available in the industry. It can be used in dipping soldering process. SnCu4.0 is effective solder alloy to minimize copper dissolution. Suitable to use on wire dipping as small as 0.03 mm. Our years of manufacturing experience has enabled us to precisely control and set stringent operating parameters to produce high quality bars.
Properties –
Melting Point
Tensile Strength
Toughness
227-322°C / 228-340°C
46.74 Mpa / 45.47 Mpa
19.001 Mpa / 15.98 Mpa
Packaging/Size Options –
Solder Bar
Solder Wire
Wire Diameter (mm)
25kg box
20kg box
0.3mm ~ 1.6mm, 2.0mm, 3.0mm
Available in –
Bar and Wire.
TECHNICAL DOCUMENTS

DS_SnCu3.0-Solder-Alloy-E-Ver-5.pdf(108.85kB)

DS_SnCu4.0-Solder-Alloy-E-Ver-6.pdf(101.97kB)
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