LFF1 (water soluble application)

🔍

LFF1 solder paste designed for water soluble application. It offers repeatable and consistent paste transfer volume, excellent solderability with reduced voiding.

Properties –

Halide Content

Flux Activity Classification

Viscosity

Powder Type

< 0.05 wt%

ROH0

600 ± 15%kcPs

Type 3

Packaging Options –

Syringe and Jar

Available Alloys –

V347 and V349

Technical Documents –

 Product Data Sheet