LFF1 (water soluble application)
LFF1 solder paste designed for water soluble application. It offers repeatable and consistent paste transfer volume, excellent solderability with reduced voiding.
Properties –
Halide Content
Flux Activity Classification
Viscosity
Powder Type
< 0.05 wt%
ROH0
600 ± 15%kcPs
Type 3
Packaging Options –
Syringe and Jar
Available Alloys –
V347 and V349
Recent Comments