Die Attach

🗸  Halogen-free (ROL0) flux system.

🗸  Trouble-free print transfer – good reproducibility of deposits.

🗸 Stable formulation – no paste drying after 16 hours of operation.

🗸 No lead-frame staining – good compatibility with over-moulding.

🗸 Fast wetting – no satellites and low void content.

🗸 Cosmetically clean appearance – no charred residue.

🗸  Full die and pad coverage – high joint reliability.

🗸 No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.