• YearEvent
• 1977Incorporation of Singapore Asahi Chemical & Solder Industries Pte. Ltd.
• 1983Asahi Metals (HK) Ltd. established
  
• 1985ISO 9003 – certification on Good Manufacturing Practice
• 1991Sinasahi Solder (M) Sdn. Bhd. established
  
• 1992ISO 9002 – certification on Manufacturing and Management Systems
• 1993Beijing Asahi Chemical & Solder Co. Ltd. established
  
•     Shenzhen Longhua Asahi Solder Co. Ltd. established
• 1995Wuxi Asahi Solder Co. Ltd. established
  
•     Developed super reflective solder alloy with high fluidity and low dross characteristics
• 1996Innovation Development Award from EDB for development of lead-free solder products
•     Developed TSF high thermal fatigue lead free solder
• 1997PT Sinasahi Solder Indonesia established
  
•     Quantum Chemical Technologies (S) Pte. Ltd. established
  
•     Matsushita Electronics Best Performance Award
• 1998PT Sanyo Best Vendor Award
• 1999Global Advance Metal Technology Pte. Ltd. established
  
• 2000Matsushita Electronics Best Supplier award
• 2001Lead Free Viromet launched
• 2002Singapore Top 500 SME award
•     Full implementation of our lead free solder products at Matsushita Electronics (S) Pte. Ltd.
  
•     Approvals by Electronics manufacturing companies Casio, Sony, Thomson, Toshiba Tech and etc.
  
•     Asahi Metals (SZ) Ltd. established
•     Asahi Technologies America Inc. established
• 2003Lead Free SCS7 launched2004   Asahi Solder Technology (Beijing) Co. Ltd. established
•     Asahi Solder Technology (Wuxi) Co. Ltd. established
•     Sony Green Partner certified lead free approval by Hitachi Communication Technologies Ltd. & Hitachi Medical Corp.
  
•     ISO 9001:2000 certified
  
•     ISO 14001:1996 certified
  
• 2005ISO 14001:2004 certified
  
• 2006SCS and Viromet listed under IPC Joint Industry Standard
  
• 2007Asahi Technologies (Thailand) Ltd. established
• 2013Murata Electronics (Thailand) Ltd. – Quality Partner award
  
• 2014Pepperl+Fuchs – Best Performance Award
• 2017Asahi (Tianjin) Solder Technology Co Ltd established
• 2018ISO 9001:2015 & ISO 14001:2015 Certified

• YearEvent
• 1994Filled the first patent of fluxless soldering.
•            Started to engage GINTIC (former SIMTech) for its reliability and SMT services.
• 1996Awarded IDS funding from EDB for our Lead Free Development project.
  1998    Filled Asahi first lead free patent and start on product developments for a Drop in
•            Replacement Solder, Viromet.
•            Gain recognition from high end industry such as medical and high reliability cum harsh
•            environment equipment.
• 2003Filled another Asahi Lead Free patent that is high reliability and cost effective especially
• for wave soldering and manual soldering process, SCS7.
  
• 2011Asahi embarked into development of Ag Paste for Renewable/Sustainable Energy.
• 2013Asahi went into the development of Ag Ink for Large Area Processing in Printed
•            Electronics.
• 2014Development of Ag Nanowires as alternative to ITOs.
• 2016Worked on Low Temperature paste, also work on semiconductor paste mainly on Die
•             Attached Paste
• 2017Patent granted for Ag Nanowires “Methods of Purifying Microstructures”
• 2018Asahi went into project collaboration with Hebrew University/Create to developed Copper
  
•             Ink for Printed Electronics.
• 2019Worked on antimicrobial solution.
•             Awarded Singapore patent for our AgNws.
• 2020Awarded US Patent for AgNws and Copper Complex Ink; Taiwan Patent for AgNws.
•            Applied new PCT patent for Thin copper Flakes for Conductive Ink.
• 2021Awarded South Korea and Singapore Patent for AgNws.
•    Antimicrobial Coating Solution is listed under Singapore Environment Agency (NEA) – Coating with Anti-virus Efficacy within 15mins contact time.
• Developed Stretchable Silver Paste and Copper Paste for Printed Electronics
• 2022Awarded China Patent for Copper Complex Ink and Japanese Patent for AgNws.
  
•             Developed Thermally Conductive Elastomers.

            Solder Paste and Silver Paste for Micro LED and die attached application.