Tacky Paste Flux
🗸 Mild flux chemistry – no-clean flux design.
🗸 Zero Halogen (ROL0) flux system – no corrosion.
🗸 Trouble-free dispensing and dipping – no tailing and no choking till syringe is empty.
🗸 High tack force – secures component in place prior to reflow.
🗸 Fast wetting – smooth solder joint.
🗸 Cosmetically clean appearance – ultra-low residue.
🗸 Negligible interfacial void – high joint reliability.
🗸 No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.
Product List
| Product code | Application | Assemble | Features |
| BAF-708 | Dispensing Printing Pin Transfer Dipping |
Ball attach | ROL0 Chemistry. High ball shear value. |
| BAF-717 | Dispensing Printing Pin Transfer Dipping |
Ball attach | ROL0 Chemistry. High ball shear value. |
| BAF-726 | Dispensing Printing Pin Transfer Dipping |
CSP assembly and rework applications |
ROL0 Chemistry. High ball shear value. |
| BAF-780 | Dispensing Printing Pin Transfer Dipping |
Ball attach, bump chip assembly |
ORM0 Chemistry. High ball shear value. |
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