Tacky Paste Flux
√ Mild flux chemistry – no-clean flux design.
√ Zero Halogen (ROL0) flux system – no corrosion.
√ Trouble-free dispensing and dipping – no tailing and no choking till syringe is empty.
√ High tack force – secures component in place prior to reflow.
√ Fast wetting – smooth solder joint.
√ Cosmetically clean appearance – ultra-low residue.
√ Negligible interfacial void – high joint reliability.
√ No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.
Product List
Product code | Application | Assemble | Features |
BAF-708 | Dispensing Printing Pin Transfer Dipping |
Ball attach | ROL0 Chemistry. High ball shear value. |
BAF-717 | Dispensing Printing Pin Transfer Dipping |
Ball attach | ROL0 Chemistry. High ball shear value. |
BAF-726 | Dispensing Printing Pin Transfer Dipping |
CSP assembly and rework applications |
ROL0 Chemistry. High ball shear value. |
BAF-780 | Dispensing Printing Pin Transfer Dipping |
Ball attach, bump chip assembly |
ORM0 Chemistry. High ball shear value. |