Water Soluble Solder Paste for SiP

AWS980-M305-D-885 is a lead-free, water-clean solder paste specially designed for SiP. AWS980-M305-D-885 has a wide print process window and bestows repeatable print deposits for 0201 pads. It confers superb wetting on Ni plate and Cu OSP in nitrogen. AWS980-M305-D-885 bestows water-soluble residue that must be removed using warm water in a batch cleaner.

TECHNICAL DOCUMENTS

DS_AWS980-M305-D-885-Water-Soluble-Solder-Paste-E-Ver-2.pdf(114.44kB)