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Application: Semiconductor
Asahi Die Attach high melting with excellent dispensing solder paste is formulated to reflow in forming gas (N2H2) and in pure N2 environment. This paste could dispense on either single or shower-head apertures and with excellent soldering performance in die-attach applications, bestowing 5% void. If desired, post soldering residue can be removed with standard cleaners and ultrasonic energy.
LIST OF PRODUCTS
Asahi Tacky Paste Fluxes are specially designed for ball-attach, BGA re-balling and BGA rework applications. Paste flux can be transferred to the pad by pin-transfer or ball-dip process involving a rotating disc a doctor’s blade for flux levelling or a drum fluxer. The operating life is >16hours without much change in viscosity. Paste fluxes can also be dispensed for BGA or SMD rework.