QF2036

QF2036 flux residue is clear and non sticky. Minimizes micro-solderballs during conventional and lead free soldering of PCB assemblies.

Properties –

Solid Content

Specific Gravity

Acid Value

Flux Classification

3.6 ± 0.2

0.792 ± 0.005

20.0 ± 2.0 mg KOH/g flux

ROM0

Application –

Soaking, Dipping, Foaming and Component Lead Tinning.

TECHNICAL DOCUMENTS