DBC Paste for IGBT

SM950-M305-D-885 is a lead-free, no-clean, no-splatter solder paste specially designed for DBC (Directly-Bonded Copper) in IGBT components. SM950-M305-D-885 has a wide print process window and bestows repeatable print deposits. It confers superb wetting on Ni-plate and Cu OSP in nitrogen, Void contents are <3% when refl owed in a vacuum oven. SM950-M305-D-885 bestows very low residue that remains close to the solder joint. Post-soldered residues can remain on the component. If desired, they can be removed using a standard cleaner and ultrasonic energy.

TECHNICAL DOCUMENTS

DS_SM950-M305-D-885-DBC-Paste-E-Ver-2.pdf(115.00kB)