SAC305H

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SAC305H solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This alloy has been designed to meet the most stringent requirements of the electronics industries.

Properties –

Melting Point

217~220 °C

Packaging/Size Options –

Solder Bar

Solid Wire

Wire Diameter (mm)

25kg box

20kg box

3.0mm

Available in –

Bar, solid wire

Technical Documents –

 Product Data Sheet