SAC305H
SAC305H solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This alloy has been designed to meet the most stringent requirements of the electronics industries.
Properties –
Melting Point
Tensile Strength
Toughness
217 +/- 2 °C
58.5 MPa
22.3 Mpa
Packaging/Size Options –
Solder Bar
Solder Wire
Wire Diameter (mm)
25kg box
20kg box
0.3mm ~ 1.6mm, 2.0mm, 3.0mm
Available in –
Bar
TECHNICAL DOCUMENTS

DS_SAC305H-Solder-Alloy-E-Ver-2.pdf(105.72kB)
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