SAC305H

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SAC305H solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This alloy has been designed to meet the most stringent requirements of the electronics industries.

Properties –

Melting Point

Tensile Strength

Toughness

217 +/- 2 °C

58.5 MPa

22.3 Mpa

Packaging/Size Options –

Solder Bar

Solder Wire

Wire Diameter (mm)

25kg box

20kg box

0.3mm ~ 1.6mm, 2.0mm, 3.0mm

Available in –

Bar

TECHNICAL DOCUMENTS

DS_SAC305H-Solder-Alloy-E-Ver-2.pdf(105.72kB)