Mini & Micro LED Solder Paste

Asahi’s LED flip-chip packaging solder paste is a lead-free, no-clean solder paste specifically developed for Micro LED / Mini LED flip-chip packaging applications. It features high-purity SAC305 alloy combined with a low-residue, high-reliability flux system, designed to meet the stringent precision and stability requirements of ultra-high-density packaging processes.

This solder paste offers exceptional printing stability, maintaining excellent print definition and solderability for several hours. Even after repeated printing or extended pauses, it consistently forms uniform, pillar-shaped solder paste deposits. This effectively prevents defects such as slump, solder beading, or misalignment, providing precise support for subsequent flip-chip placement and reflow soldering processes.

Product Features
🗸 Specifically designed for Micro LED / Mini LED
🗸 Excellent printing resolution and precision
🗸 Superior slump resistance
🗸 Stable open time and long printing life
🗸 Low-residue, no-clean system
🗸 Consistent solder joints and excellent solderability

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