Medium/Low Temperature Solder Paste

The mid/low-temperature lead-free solder paste developed by Singapore Asahi is specifically designed to meet the requirements of assembling temperature-sensitive components and multilayer PCBs. This solder paste features an advanced alloy formulation that delivers excellent wettability during mid-to-low temperature reflow processes, ensuring stable solder joint formation and high-quality interconnections.

Product Features
🗸 Low-temperature reflow capability
🗸 Excellent wettability
🗸 Good slump resistance
🗸 High printing resolution and stability
🗸 Long tack time and printing life
🗸 Highly insulating post-soldering residue

Product List