High Reliability Solder Paste

Singapore Asahi offers a range of solder paste products designed to address the unique soldering characteristics of surface mount technology (SMT) processes, such as high-speed printing and optimal distribution of interconnects between circuit pads. Singapore Asahi’s solder pastes deliver excellent solder joint consistency and provide the highest performance reliability under harsh operating conditions, in accordance with industry requirements.

Product Features
🗸 Excellent printing performance for fine-pitch components
🗸 Outstanding wettability
🗸 Colorless and transparent post-soldering flux residue
🗸 Good slump resistance
🗸 Prevents solder balling and bridging defects
🗸 Long stencil life and tack time
🗸 Forms strong solder joints
🗸 Wide process window

Product List

Product Code
Alloy
Melting Point
Powder Size
Class
Reflow Peak Temp
SAC305 4-5MH080
SAC305
217 – 220°C
4 (20 – 38µm)
ROL0
≥ 235°C
SAC305 5-5MH080
217 – 220°C
5 (15 – 25µm)
ROL0
≥ 235°C
SAC305 4-5MH098
217 – 220°C
4 (20 – 38µm)
ROL0
≥ 235°C
SAC305 5-5MH098
217 – 220°C
5 (15 – 25µm)
ROL0
≥ 235°C
SAC305 4-5MX108
217 – 220°C
4 (20 – 38µm)
ROL1
≥ 235°C
SAC305 5-5MX108
217 – 220°C
5 (15 – 25µm)
ROL1
≥ 235°C
SAC0307 4-5MH080
SAC0307
217 – 227°C
4 (20 – 38µm)
ROL0
≥ 240°C
SAC0307 4-5MH098
217 – 227°C
4 (20 – 38µm)
ROL0
≥ 240°C
SAC0307 4-5MX108
217 – 227°C
4 (20 – 38µm)
ROL1
≥ 240°C
SACB1053 4-5MH080
SACB1053
211 – 221°C
4 (20 – 38µm)
ROL0
≥ 235°C
SACB1053 4-5MH098
211 – 221°C
4 (20 – 38µm)
ROL0
≥ 235°C