About Us: Milestones

Company Milestones

Year Event
1977
Incorporation of Singapore Asahi Chemical & Solder Industries Pte. Ltd.
1983
Asahi Metals (HK) Ltd. established
1985
ISO 9003 – certification on Good Manufacturing Practice
1991
Sinasahi Solder (M) Sdn. Bhd. established
1992
ISO 9002 – certification on Manufacturing and Management Systems
1993
– Beijing Asahi Chemical & Solder Co. Ltd. established
– Shenzhen Longhua Asahi Solder Co. Ltd. established
1995
– Wuxi Asahi Solder Co. Ltd. established
– Developed super reflective solder alloy with high fluidity and low dross characteristics
1996
– Innovation Development Award from EDB for development of lead-free solder products
– Developed TSF high thermal fatigue lead free solder
1997
– PT Sinasahi Solder Indonesia established
– Quantum Chemical Technologies (S) Pte. Ltd. established
– Matsushita Electronics Best Performance Award
1998
PT Sanyo Best Vendor Award
1999
Global Advance Metal Technology Pte. Ltd. established
2000
Matsushita Electronics Best Supplier award
2001
Lead Free Viromet launched
2002
– Singapore Top 500 SME award
– Full implementation of our lead free solder products at Matsushita Electronics (S) Pte. Ltd.
– Approvals by Electronics manufacturing companies Casio, Sony, Thomson, Toshiba Tech and etc.
– Asahi Metals (SZ) Ltd. established
– Asahi Technologies America Inc. established
2003
Lead Free SCS7 launched
2004
– Asahi Solder Technology (Beijing) Co. Ltd. established
– Asahi Solder Technology (Wuxi) Co. Ltd. established
– Sony Green Partner certified 
– Lead free approval by Hitachi Communication Technologies Ltd. & Hitachi Medical Corp.
– ISO 9001:2000 certified
– ISO 14001:1996 certified
2005
ISO 14001:2004 certified
2006
SCS and Viromet listed under IPC Joint Industry Standard
2007
Asahi Technologies (Thailand) Ltd. established
2013
Murata Electronics (Thailand) Ltd. – Quality Partner award
2014
Pepperl+Fuchs – Best Performance Award
2017
Asahi (Tianjin) Solder Technology Co Ltd established
2018
ISO 9001:2015 & ISO 14001:2015 Certified

 

Technologies Milestones

 

Year Event
1994
Filled the first patent of fluxless soldering.
Started to engage GINTIC (former SIMTech) for its reliability and SMT services.
1996
Awarded IDS funding from EDB for our Lead Free Development project.
1998
– Filled Asahi first lead free patent and start on product developments for a Drop in Replacement 
   Solder, Viromet.
– Gain recognition from high end industry such as medical and high reliability cum harsh 
    environment equipment.
2003
Filled another Asahi Lead Free patent that is high reliability and cost effective especially for 
wave soldering and manual soldering process, SCS7.
2011
Asahi embarked into development of Ag Paste for Renewable/Sustainable Energy.
2013
Asahi went into the development of Ag Ink for Large Area Processing in Printed Electronics.
2014
Development of Ag Nanowires as alternative to ITOs.
2016
Worked on Low Temperature paste, also work on semiconductor paste mainly on Die Attached Paste.
2017
Patent granted for Ag Nanowires “Methods of Purifying Microstructures”
2018
Asahi went into project collaboration with Hebrew University/Create to developed Copper Ink 
for Printed Electronics.
2019
– Worked on antimicrobial solution
– Awarded Singapore patent for our AgNws.
2020
– Awarded US Patent for AgNws and Copper Complex Ink; Taiwan Patent for AgNws.
– Applied new PCT patent for Thin copper Flakes for Conductive Ink.
2021
– Awarded South Korea and Singapore Patent for AgNws.
– Antimicrobial Coating Solution is listed under Singapore Environment Agency (NEA) –Coating with 
   Anti-virus Efficacy within 15mins contact time.
– Developed Stretchable Silver Paste and Copper Paste for Printed Electronics
2022
– Awarded China Patent for Copper Complex Ink and Japanese Patent for AgNws.
– Developed Thermally Conductive Elastomers.
– Solder Paste and Silver Paste for Micro LED and die attached application.