Water Soluble Solder Paste

Singapore Asahi’s water-soluble solder paste is formulated with a high-reliability water-washable flux and high-sphericity, low-oxide lead-free alloy powder. It is precisely engineered through a scientific blend and advanced manufacturing processes. The solder paste offers excellent wettability and solderability, meeting high-quality soldering requirements while ensuring consistent solder joints and long-term reliability.

In terms of cleaning, the flux residue is easily soluble in water and can be quickly and efficiently removed using deionized water, leaving the surface clean and free of corrosive residues after washing.

Product Features
🗸 Strong water-washable cleanability
🗸 High-reliability water-washable flux system
🗸 Excellent wettability and solderability
🗸 Stable printing performance
🗸 Long tack time and printing life

Product List

Product Code
Alloy
Melting Point
Powder Size
Class
Reflow Peak Temp
V347 3-4LFF1
V347
202 – 207°C
3 (25 – 45µm)
ROH0
≥ 220°C
V347 4-4LFF1
202 – 207°C
4 (20 – 38µm)
ROH0
≥ 220°C
V349 3-4LFF1
V349
205 – 210°C
3 (25 – 45µm)
ROH0
≥ 225°C
V349 4-4LFF1
205 – 210°C
4 (20 – 38µm)
ROH0
≥ 225°C