SnPb Solder Paste

Singapore Asahi’s SnPb solder paste is specifically developed for high-precision surface mount technology (SMT) processes, particularly suited for fine-pitch applications, supporting component assembly with pitch as small as 0.4 mm. This solder paste utilizes high-purity, low-oxidation solder powder combined with an advanced halogen-free flux system, ensuring excellent soldering performance while also addressing environmental concerns and residue control.

Product Features
🗸 Excellent printing uniformity
🗸 Long printing life
🗸 No hot or cold slump
🗸 Excellent solderability and wettability on both copper and nickel-plated substrates

Product List

Product Code
Alloy
Melting Point
Powder Size
Class
Reflow Peak Temp
Sn63 3-5M097
Sn63Pb37
183°C
3 (25 – 45µm)
ROL0
≥ 205°C
Sn63 4-5M097
183°C
4 (20 – 38µm)
ROL0
≥ 205°C
SnPbAg0.4 4-5M097
SnPbAg0.4
179 – 183°C
4 (20 – 38µm)
ROL0
≥ 205°C