SnPb Solder Paste

Singapore Asahi’s SnPb solder paste is specifically developed for high-precision surface mount technology (SMT) processes, particularly suited for fine-pitch applications, supporting component assembly with pitch as small as 0.4 mm. This solder paste utilizes high-purity, low-oxidation solder powder combined with an advanced halogen-free flux system, ensuring excellent soldering performance while also addressing environmental concerns and residue control.
Product Features
🗸 Excellent printing uniformity
🗸 Long printing life
🗸 No hot or cold slump
🗸 Excellent solderability and wettability on both copper and nickel-plated substrates
Product List
Product Code |
Alloy |
Melting Point |
Powder Size |
Class |
Reflow Peak Temp |
Sn63 3-5M097 |
Sn63Pb37 |
183°C |
3 (25 – 45µm) |
ROL0 |
≥ 205°C |
Sn63 4-5M097 |
183°C |
4 (20 – 38µm) |
ROL0 |
≥ 205°C |
|
SnPbAg0.4 4-5M097 |
SnPbAg0.4 |
179 – 183°C |
4 (20 – 38µm) |
ROL0 |
≥ 205°C |