Asahi SAC305, Sn96.5Ag3.0Cu0.5 solder alloy was developed to have better fluidity and low drossing in dipping and wave soldering process. For stabilization of copper, Cu content in the soldering pot, Asahi SnAg3.0, Sn97.0Cu3.0 alloy will be recommended as a top up solder. Asahi SAC305 is also developed to have better wetting and spreadability. Asahi SAC305 and SnAg3.0 solder alloys are available in hand-casted and extruded bar form. They are also available in solid wire form for auto-feeding system. Asahi alloys could be produced into any forms upon users request and application.

Properties –

Melting Point

Tensile Strength


Cycle Fatigue Resistance

217 – 220 °C

48.548 MPa

23.126 Mpa


Packaging/Size Options –

Solder Bar

Solder Wire

Wire Diameter (mm)

25kg box

20kg box

0.3mm ~ 1.6mm, 2.0mm, 3.0mm

Available in –

Bar, Wire and Paste