Inorganic Component Tinning Liquid Flux

Singapore Asahi’s inorganic coating flux is a highly active inorganic acidic flux formulated primarily with zinc ammonium. It features a smokeless, non-flammable, water-soluble composition and is specially designed for dip soldering processes. This flux effectively restores the solderability of contaminated copper surfaces, making it especially suitable for heavily oxidized or soiled materials.

During the soldering of tin-plated pads or other metallic surfaces, this flux forms a dense, void-free inorganic alloy layer. By bonding with the base metal, it delivers excellent solder joint strength and reliability. In addition, the flux residue can be easily removed with water, completely eliminating ionic contamination on copper wires. This ensures a clean post-solder surface that meets stringent electrical performance requirements.

Product Features
🗸 Suitable for tin-plated pads and other metal surfaces
🗸 Excellent wettability
🗸 Widely applicable in hot dip soldering processes
🗸 Easy to clean

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