Singapore Asahi Viromet series solder paste is a high-reliability, halogen-free solder paste developed based on SAC-X lead-free alloy, specifically designed to meet the demands of rigorous electronic manufacturing processes. Viromet solder features a lower melting point, making it suitable for low-temperature reflow processes. It is particularly ideal for temperature-sensitive components and multilayer PCB materials, effectively reducing the risk of thermal stress.
The Viromet series adopts an advanced halogen-free formulation that complies with international environmental standards such as RoHS and IEC 61249-2-21. It significantly minimizes the generation of corrosive byproducts during soldering, enhancing long-term stability and operational safety. With excellent wettability, consistent solder joint formation, and strong resistance to thermal cycling, the Viromet series stands out in critical high-reliability applications.
This product is widely used in automotive electronics, medical devices, high-speed rail and rail transit control boards, industrial electronics, and aerospace applications. Thanks to its outstanding performance under harsh conditions, the Viromet series solder paste is the preferred solution for high-end electronic manufacturing customers who prioritize both long-term stability and environmental compliance.
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