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Hot Air Solder Levelling Liquid Flux
Singapore Asahi HASL Liquid Flux is specially formulated for both SnPb and lead-free solder coatings used in hot air leveling on bare copper boards. It contains proprietary activators and wetting agents dissolved in a multi-component solvent system. The flux efficiently removes oxides and forms a robust protective coating that shields the boards from heat damage. Its effective wetting agents ensure rapid and uniform flux penetration across all areas of the board.
Product Features
🗸 Superior wettability
🗸 Excellent solderability
🗸 Uniform penetration of flux to all areas
🗸 Effectively removes the oxides and provides a thick flux coating to the boards
🗸 Superior wettability
🗸 Excellent solderability
🗸 Uniform penetration of flux to all areas
🗸 Effectively removes the oxides and provides a thick flux coating to the boards
Product List
| Product code | HA8000 | HA8008 |
| Solid content | 23.0 | 66.0 |
| Specific gravity | 1.044 | 1.040 |
| Halide content | Not detected | 1.10 |
| Acid value | 19.0 | 47.0 |