BGA Ball

Asahi’s BGA ball products cover a wide range of ball diameters and sizes. In addition to traditional tin-silver-copper alloys, we have developed a variety of alloy compositions. To meet different melting points and application requirements, we offer a series of solder ball products suitable for various operating temperatures and soldering demands.

The solder balls are spherical in shape, with smooth surfaces, free from oxidation, cracks, dents, or other defects. A wide range of size specifications is available, and selections can be made according to specific packaging requirements.

     Alloy types: SAC305, V347, V349, Pure Tin, etc.

     Diameter: 0.762mm, 0.50mm, 0.45mm, 0.40mm, 0.30mm, 0.20mm, 0.10mm, 0.08mm

     All sizes of solder spheres come in 500 kpcs,250 kpcs or 1 million pcs per pack.

     For any other sizes or packing, please inform our Marketing Department.