MLED01 (for micro LED printing)

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MLED01 lead free no clean solder paste is designed for superior performance on assemblies with ultra-fine pitch components and LED flip-chip package of mirco LED.

Properties –

Halide Content

Flux Activity Classification

Viscosity

Powder Type

Not Added

ROL0

550 ± 250 kcPs

Type 5 and 6

Packaging Options –

Syringe and Jar

Available Alloys –

SAC305

Technical Documents –

 Product Data Sheet