Tacky Paste Flux

√ Mild flux chemistry – no-clean flux design.

√ Zero Halogen (ROL0) flux system – no corrosion.

√ Trouble-free dispensing and dipping – no tailing and no choking till syringe is empty.

√ High tack force – secures component in place prior to reflow.

√ Fast wetting – smooth solder joint.

√ Cosmetically clean appearance – ultra-low residue.

√ Negligible interfacial void – high joint reliability.

√ No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.

Product List
Product code Application Assemble Features
BAF-708 Dispensing
Printing
Pin Transfer
Dipping		 Ball attach ROL0 Chemistry. High ball shear
value.
BAF-717 Dispensing
Printing
Pin Transfer
Dipping		 Ball attach ROL0 Chemistry. High ball shear
value.
BAF-726 Dispensing
Printing
Pin Transfer
Dipping		 CSP assembly and rework
applications		 ROL0 Chemistry. High ball shear
value.
BAF-780 Dispensing
Printing
Pin Transfer
Dipping		 Ball attach, bump chip
assembly		 ORM0 Chemistry. High ball shear
value.