English
SEMICONDUCTOR
BALL ATTACH
Tacky Paste Flux – BAF-708
BAF-708 is a no-clean assembly flux specially designed for ball-attach, BGA re-balling and BGA rework applications. BAF-708 can be transferred to the pad by pin-transfer or ball-dip process involving a rotating disc a...
Tacky Paste Flux – BAF-780
BAF780 Water-Clean Tacky Flux has been specially conceived for ball-attach, bumped chip assembly, re-balling and rework applications with lead-bearing and lead-free solder spheres or alloys. It is adapted for high UPH...
Tacky Paste Flux – BAF-726
BAF-726 is a no-clean fl ux specially designed for CSP assembly and rework applications. BAF-726 can be transferred to the pad by pin-transfer or chip-dip process involving a rotating disc a doctor’s blade for fl ux l...
Tacky Paste Flux – BAF-717
BAF717 is a no-clean assembly flux specially designed for ball-attach, BGA re-balling, BGA rework and PoP applications. BAF717 can be transferred to the pad by pin-transfer or ball-dip process involving a rotating disc...