Tacky Paste Flux – BAF-726
BAF-726 is a no-clean fl ux specially designed for CSP assembly and rework applications. BAF-726 can be transferred to the pad by pin-transfer or chip-dip process involving a rotating disc a doctor’s blade for fl ux levelling. The operating-life is >16 hours (20-25ºC and RH 45-65%) without much change in viscosity. BAF726 can also be dispensed or printed for BGA or SMD rework. The post-soldered residue is ultra low, benign and can left on the circuit. If desired, the residue can be removed with most commercial solvents and megasonic energy.
TECHNICAL DOCUMENTS

DS_BAF-726-Tacky-Paste-Flux-E-Ver-1.pdf(162.45kB)
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