Tacky Paste Flux – BAF-708

BAF-708 is a no-clean assembly flux specially designed for ball-attach, BGA re-balling and BGA rework applications. BAF-708 can be transferred to the pad by pin-transfer or ball-dip process involving a rotating disc a doctor’s blade for flux levelling or a drum fluxer. The operating life is >16 hours without much change in viscosity. BAF-708 can also be dispensed for BGA or SMD rework. Post-soldered residue is low and benign. If desired, residue can be removed with standard cleaners and megasonic energy.

TECHNICAL DOCUMENTS

DS_BAF-708-Tacky-Paste-Flux-E-Ver-2.pdf(161.62kB)