Die Attach Paste Flux – P925 3-ADAF912

P925 3-ADAF912-E high temperature solder paste was developed to give excellent pin transfer and soldering performance in die-attach applications. It is a halogen-free solder paste that bestows clear no-clean residue when reflowed in a forming gas or in nitrogen. If desired, post-soldered residue can be removed with standard cleaners and ultrasonic energy.

Properties –

Halide Content

Flux Activity Classification

Viscosity

<900ppm

ROL0

15 – 50 Pa.s

Packaging options –

Syringe and Jar

TECHNICAL DOCUMENTS