Copper Complex Ink CCI-330I

Asahi Copper Complex Ink is specially formulated for ink jet printing to meet the demand of printed electronics and is also a good replacement for “Pd-free” seed used in the electroless plating process. Copper complex ink can be screen printed or inkjetted and decomposed upon short exposure to plasma or air (both inert or normal) to form a seed layer for electroless plating process that will form highly conductive traces on both 2D and 3D structures.

Properties –

Application –

CCI330I is suitable with many 2D and 3D structures including PI, PEN, PET, etc and ability to cure under both plasma and thermal cure (Inert) environment.

TECHNICAL DOCUMENTS

DS_CCI-330I-Cu-Complex-Ink-E-Ver-1.pdf(271.54kB)