Die Attach
√ Halogen-free (ROL0) flux system.
√ Trouble-free print transfer – good reproducibility of deposits.
√ Stable formulation – no paste drying after 16 hours of operation.
√ No lead-frame staining – good compatibility with over-moulding.
√ Fast wetting – no satellites and low void content.
√ Cosmetically clean appearance – no charred residue.
√ Full die and pad coverage – high joint reliability.
√ No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.
Product List
Product code | Alloy | Application /Assemble | Features |
P925 3‐ ADAF912‐E | P925 | Dispensing /Die-attach, leadframe attach | Discrete power package assembly in forming gas (N2H2) |
SM950‐M305‐D‐885 | SAC305s | Printing / IGBT base plate | IGBT base plate assembly in vacuum oven under N2 |
AWS980‐M305‐D‐885 | SAC305s | Printing / SiP | SiP assembly in vacuum oven under N2 |