√ Halogen-free (ROL0) flux system.
√ Trouble-free print transfer – good reproducibility of deposits.
√ Stable formulation – no paste drying after 16 hours of operation.
√ No lead-frame staining – good compatibility with over-moulding.
√ Fast wetting – no satellites and low void content.
√ Cosmetically clean appearance – no charred residue.
√ Full die and pad coverage – high joint reliability.
√ No-clean formulation – if desired, residue can be removed with standard cleaners with ultrasonic energy.
|Product code||Alloy||Application /Assemble||Features|
|P925 3‐ ADAF912‐E||P925||Dispensing /Die-attach, leadframe attach||Discrete power package
assembly in forming gas
|SM950‐M305‐D‐885||SAC305s||Printing / IGBT base plate||IGBT base plate assembly in
vacuum oven under
|AWS980‐M305‐D‐885||SAC305s||Printing / SiP||SiP assembly in vacuum
oven under N2