Asahi Copper Particle Paste is specially formulated with our core-shell copper particles to meet the demand for printed electronics, a solution for flexible hybrid electronics and printable electronics with excellent stability and good electrical conductivity.  Conventionally, the main obstacle for using copper particles is their stability and spontaneous oxidation in ambient conditions.  The cored shell technology of Asahi copper particle prevents oxidation from taking place and preserves its metallic characteristic.  Asahi copper paste provide excellent adhesion on various substrates and sintered in normal air convection curing oven.

Product code	Description	Curing Condition	Viscosity, cps @ 20rpm	Sheet Resistivity	Shelf Life
CPP-F72C27R	Low voltage circuitry printing on heat sensitive substrate, flexible electrode printing	120 – 150°C for 2 – 3 mins	30~90 Kcps	< 75 mΩ/□/mil	6 months (~25°C)
CPP-CAF1	Low cost application with high electrical conductivity, capable of withstanding thermoforming and overmolding temperatures.	120°C for 5 mins	10,000 to 30,000 cP	< 80 mΩ/□/mil	6 months (~25°C)